The effect of etching gases on notching and charging in high-density plasma

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 6 A, 1998, Pages 3570-3575

  Tabara, Suguru ^a  

^a YAMAHA CORPORATION   (Japan)

Author keywords

Charging damage; Electron shading; HCl plasma; High density plasma; Notching; Plasma etching; Proton

Indexed keywords

EID: 0012267701     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.3570     Document Type: Article

References (16)

1. S. Tabara: Jpn. J. Appl. Phys. 35 (1996) 2456.
2. S. Tabara: Proc. Int. Symp. Plasma Process-Induced Damage, Santa Clara, 1996, p. 51.
3. N. Fujiwara, T. Maruyama, M. Yoneda and K. Tsukamoto: Proc. 15th Symp. Dry Process (Institute of Electrical Engineers, Tokyo, 1993) p. 45.
4. N. Fujiwara, T. Maruyama and M. Yoneda: Proc. 16th Symp. Dry Process (Institute of Electrical Engineers, Tokyo, 1994) p. 31.
5. T. Nozawa, T. Kinoshita, T. Nishizuka, A. Narai, T. Inoue and A. Nakaue: Proc. 16th Symp. Dry Process (Institute of Electrical Engineers, Tokyo, 1994) p. 37.
6. N. Fujiwara, T. Maruyama and M. Yoneda: Jpn. J. Appl. Phys. 34 (1995) 2095.
7. S. C. McNevin: J. Vac. Sci. & Technol. B 8 (1990) 1212.
8. D. Takehara, M. Sato, A. Ishihara and K. Sakiyama: Proc. 15th Symp. Dry Process (Institute of Electrical Engineers, Tokyo, 1993) p. 51.
9. K. Hashimoto: Jpn. J. Appl. Phys. 32 (1993) 6109.
10. S. Tabara: J. Vac. Sci. & Technol. B 15 (1997) 675.
11. Data from Lam Research Co., Ltd., Japan.
12. K. Hashimoto, Y. Hikosaka, A. Hasegawa and M. Nakamura: Proc. 17th Symp. Dry Process (Institute of Electrical Engineers of Japan, Tokyo, 1995), p. 33.
13. W. R. Harshbarger, H. J. Levinstein, C. J. Mogab and R. A. Poter: U. S. Patent No. 4,208,241 (1980).
14. N. Fujiwara, T. Maruyama and M. Yoneda: Tech. Rep. IEICE SMD96-61 (1996) 31.
15. G. S. Hwang and K. P. Giapis: Appl. Phys. Lett. 71 (1997) 1942.
16. S. Yanagawa, Japan Patent Laid-Open Publication 130206 (1996) [in Japanese].