Compression-molded three-dimensional tapered polymeric waveguides for low-loss optoelectronic packaging

IEEE Photonics Technology Letters

Volumn 9, Issue 12, 1997, Pages 1601-1603

  Wu, Linghui ^a,b   Li, Feiming ^b   Tang, Suning ^c   Bihari, Bipin ^b   Chen, Ray T ^a,b  

^a IEEE   (United States)

^b The University of Texas at Austin   (United States)

^c RADIANT RESEARCH   (United States)

Author keywords

Optical interconnections; Optoelectronic packaging; Tapered waveguides

Indexed keywords

COMPRESSION MOLDING; ELECTRONICS PACKAGING; HELIUM NEON LASERS; OPTICAL COMMUNICATION; OPTICAL INTERCONNECTS; OPTOELECTRONIC DEVICES;

OPTOELECTRONIC PACKAGING; TAPERED POLYMERIC WAVEGUIDES;

OPTICAL WAVEGUIDES;

EID: 0031338726     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/68.643281     Document Type: Article

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