The influence of residual stress and membrane thickness on the performance of Fe-Ni-Cr/Invar bimetal freestanding membrane for microdevices

Sensors and Actuators, A: Physical

Volumn 101, Issue 1-2, 2002, Pages 160-167

  Hsu, Yu Jung ^a   Chang, Yen Hwei ^a   Chai, Yin Lai ^b   Chen, Guo Ju ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b DAHAN INSTITUTE OF TECHNOLOGY   (Taiwan)

^c I SHOU UNIVERSITY   (Taiwan)

Author keywords

Deflection; Flexural rigidity; Membrane; Residual stress; Young's modulus

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELASTIC MODULI; MEMBRANES; RESIDUAL STRESSES; RIGIDITY; THERMAL LOAD;

FLEXURAL RIGIDITY; MEMBRANE THICKNESS; MICRODEVICES;

MICROELECTROMECHANICAL DEVICES;

EID: 0037201867     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00213-3     Document Type: Article

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