Residual stress and thermal stability of the Fe-Ni-Cr/Invar bimetal membrane used for microactuation

Thin Solid Films

Volumn 418, Issue 2, 2002, Pages 189-196

  Hsu, Yu Jung ^a   Chang, Yen Hwei ^a   Chai, Yin Lai ^b   Chen, Guo Ju ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b DAHAN INSTITUTE OF TECHNOLOGY   (Taiwan)

^c I SHOU UNIVERSITY   (Taiwan)

Author keywords

Bimorph structure; Bulge test; Residual stress

Indexed keywords

BIMETALS; MICROSTRUCTURE; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; THERMODYNAMIC STABILITY;

BIMETAL MEMBRANES; MICROACTUATION;

THIN FILMS;

EID: 0037109226     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00707-1     Document Type: Article

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