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Volumn 91, Issue 2, 2002, Pages 639-645
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Evolution of end-of-range damage and transient enhanced diffusion of indium in silicon
a |
Author keywords
[No Author keywords available]
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Indexed keywords
CZOCHRALSKI SILICON WAFERS;
DEFECT GROWTH;
DIFFUSION MODEL;
DIFFUSION SYSTEMS;
DISLOCATION LOOP;
END-OF-RANGE DAMAGES;
GROWTH STEPS;
HIGH-TEMPERATURE ANNEALING;
INDIUM SEGREGATION;
INTERSTITIALS;
NEAR SURFACE REGIONS;
P-TYPE;
PHYSICALLY BASED MODELS;
POST-IMPLANTATION;
TRANSIENT ENHANCED DIFFUSION;
DIFFUSION;
ENHANCED RECOVERY;
OSTWALD RIPENING;
SECONDARY ION MASS SPECTROMETRY;
SILICON WAFERS;
SURFACE SEGREGATION;
TRANSMISSION ELECTRON MICROSCOPY;
INDIUM;
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EID: 0037080710
PISSN: 00218979
EISSN: None
Source Type: Journal
DOI: 10.1063/1.1421213 Document Type: Article |
Times cited : (30)
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References (28)
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