Novel MBB technology using electroless plated Ni and In bumps

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 169-173

  Ohtsuka, Takashi ^a   Kawakita, Tetsuo ^a   Fujimoto, Hiroaki ^a   Hatada, Kenzo ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; ELECTRODES; ELECTROLESS PLATING; INDIUM; INTEGRATED CIRCUIT MANUFACTURE; LSI CIRCUITS; NICKEL; PLASTICITY; SOLDERING ALLOYS;

MICROBUMP BONDING (MBB); TRANSFER METHOD;

SOLDERING;

EID: 0030689575     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)