Multi-layers with Buried Structures (MLBS): An approach to three-dimensional integration

IEEE International SOI Conference

Volumn , Issue , 2001, Pages 117-118

  Xue, L ^a   Liu, C C ^a   Tiwari, S ^a  

^a Cornell University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CMOS INTEGRATED CIRCUITS; CRYSTALLIZATION; DIELECTRIC MATERIALS; MULTILAYERS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; SINGLE CRYSTALS;

MULTI-LAYERS WITH BURIED STRUCTURES (MLBS);

SEMICONDUCTOR DEVICE STRUCTURES;

EID: 0035158964     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)