System for real-time measurement of thermally induced PWB/PWA warpage

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 1, 1997, Pages 1-8

  Stiteler, M R ^a   Ume, I C ^b  

^a South Carolina Research Authority   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; DEFORMATION; PRINTED CIRCUIT BOARDS; REAL TIME SYSTEMS; SOLDERING;

AUTOMATED ON LINE WARPAGE MEASUREMENT SYSTEMS; INFRARED REFLOW SOLDERING; PRINTED WIRING BOARD ASSEMBLIES (PWBA); SHADOW MOIRE MEASUREMENTS;

ELECTRONICS PACKAGING;

EID: 0031094653     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792196     Document Type: Article

References (7)

1. Fu, C., and Urne, C., 1995, “Characterizing the Temperature Dependence of Electronic Packaging Material Properties,” JOM, Vol. 47, No. 6, pp. 31-35.
2. Guo, Y., 1995, “Application of Shadow Moiré Method in Electronic Packaging,” Proceedings, 1995 SEM Spring Conference and Exhibit, Grand Rapids, MI, June 12-14.
3. Kobayashi, A., ed., Handbook on Experimental Mechanics, Prentice Hall, NJ, pp. 282-313.
4. Tsang, C., Stiteler, M., and Urne, C., 1995, “Real-Time Measurement of Printed Wiring Board Flatness in a Simulated Manufacturing Environment,” INTERpack '95, Lahaina, Hawaii, March 26-30.
5. Walter, R., 1980, “Warpage Reduction During Wave Soldering,” presented, IPC Annual Meeting, Orlando, FL.
6. Yeh, C., Urne, C., Fulton, R., Wyatt, K., and Stafford, J., 1993, “Analytical and Experimental Approaches to Determine Thermally Induced PWB Warpage,” IEEE Transactions in Components, Hybrids, and Manufacturing Technology, Vol. 16, No. 8, pp. 986-995.
7. Chang, F. P., “Moiré Methods of Strain Analysis,” SESA Manual on Experimental Stress Analysis, 3rd ed., pp. 290-308