|
|
Volumn 36, Issue 7, 1999, Pages 46-53
|
|
Power to the package
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ELECTRIC POTENTIAL;
FLIP CHIP DEVICES;
INTEGRATED CIRCUIT MANUFACTURE;
MICROPROCESSOR CHIPS;
MULTICHIP MODULES;
PERSONAL COMPUTERS;
PRINTED CIRCUIT BOARDS;
RANDOM ACCESS STORAGE;
SEMICONDUCTOR DEVICES;
SUBSTRATES;
THERMAL EXPANSION;
BALL GRID ARRAY;
CHIP SCALE PACKAGE;
INDUCTANCE;
PIN GRID ARRAY;
QUAD FLAT PAC;
ELECTRONICS PACKAGING;
|
|
EID: 0032656474
PISSN: 00189235
EISSN: None
Source Type: Journal
DOI: 10.1109/6.774965 Document Type: Article |
|
Times cited : (12)
|
|
References (0)
|
