Photonics challenge to electronic packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 309-311

  Gilleo, K ^a  

^a Cookson Electronics ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; DATA COMMUNICATION SYSTEMS; DENSE WAVELENGTH DIVISION MULTIPLEXING; FIBER OPTICS; HERMETIC SEALS; OPTICAL COMMUNICATION; OPTICAL SWITCHES; OPTOELECTRONIC DEVICES;

TERRESTRIAL COMMUNICATION SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0035363970     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926399     Document Type: Review

References (5)

1. MOEMS the word
2. Digital light processing TM for high-brightness
3. From ICs to DMDs
4. Suitability of an epoxy seal for a MEMS package
5. Research opportunities in MEMS manufacturing