An overview of high temperature electronics and sensor development at NASA Glenn research center

American Society of Mechanical Engineers, International Gas Turbine Institute, Turbo Expo (Publication) IGTI

Volumn 1, Issue , 2002, Pages 153-160

  Hunter, Gary W ^a   Neudeck, Philip G ^a   Okojie, Robert S ^a   Beheim, Glenn M ^a   Powell, J A ^a   Chen, Liangyu ^b  

^a NASA GLENN RESEARCH CENTER   (United States)

^b OHIO AEROSPACE INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH TEMPERATURE ELECTRONICS; INTELLIGENT ENGINE; SENSOR TECHNOLOGY DEVELOPMENT; SILICON CARBIDE ELECTRONIC MATERIALS;

ARTIFICIAL INTELLIGENCE; AVIONICS; ELECTRONIC EQUIPMENT; HIGH TEMPERATURE OPERATIONS; SENSORS; SILICON CARBIDE;

JET ENGINES;

EID: 0036997607     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/GT2002-30624     Document Type: Conference Paper

References (16)

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3. 2/Pt Ohmic Contacts on N-Type 6H-SiC Epilayer at 600°C in Air", Mat. Res. Soc. Symp. Proc., 622, Wide-Bandgap Electronic Devices, R. J. Shul, F. Ren, M. Murakami, and W. Pletschen, Eds. Warrandale, PA: Materials Research Society.
4. Okojie, R.S., Beheim, G. M., Saad, G. J., and Savrun, E., 2001, "Characteristics Of A Hermetic 6H-SiC Pressure Sensor At 600°C", AIAA 2001-4652.
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11. Chen, L.-Y., Okojie, R. S., Neudeck, P. G., and Hunter, G. W., 2001, "Material System for Packaging 500°C MicroSystems", MRS Proceedings, Symposium N: Microelectronic, Optoelectronic, and MEMS Packaging, San Francisco, CA, April 16-20.
12. Chen, L.-Y., Hunter, G. W., and Neudeck, P. G., 2000, "Silicon Carbide Die Attach Scheme for 500°C Operation," MRS 2000 Spring Meeting Proceedings-Wide-Bandgap Electronic Devices (Symposium T), San Francisco, CA, Apr. 10-14.
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16. Neudeck, P.G., Powell, J.A., Trunek, A. J., Huang, X. R., Dudley, M., 2002, "Growth of Defect-Free 3C-SiC on 4H- and 6H-SiC Mesas Using Step-Free Surface Heteroepitaxy," to be published in Silicon Carbide and Related Materials, Materials Science Forum, 389-393, pp. 311-314.