Characteristics of a hermetic 6H-SiC pressure sensor at 600°C

AIAA Space 2001 Conference and Exposition

Volumn , Issue , 2001, Pages

  Okojie, Robert S ^a   Beheim, Glenn M ^a   Saad, George J ^a   Savrun, Ender ^b  

^a NASA GLENN RESEARCH CENTER   (United States)

^b Sienna Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMECHANICAL DEVICES; ELECTRONICS PACKAGING; MEMS; PRESSURE SENSORS; SILICON CARBIDE; SINGLE CRYSTALS;

DIRECT CHIP ATTACH; FABRICATION AND CHARACTERIZATIONS; HERMETICALLY SEALED; HIGH TEMPERATURE; INPUT VOLTAGES; WIRE BONDING; WIRE BONDS;

SILICON COMPOUNDS;

EID: 85016834212     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.2514/6.2001-4652     Document Type: Conference Paper

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