Material system for packaging 500°C SiC microsystems

Materials Research Society Symposium Proceedings

Volumn 682, Issue , 2001, Pages 79-90

  Chen, Liang Yu ^a   Okojie, Robert S ^b   Neudeck, Philip G ^b   Hunter, Gary W ^b   Lin, Shun Tien T ^c  

^a OHIO AEROSPACE INSTITUTE   (United States)

^b NASA GLENN RESEARCH CENTER   (United States)

^c UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; GOLD; SCHOTTKY BARRIER DIODES; SILICON CARBIDE; THICK FILMS;

ELECTRICAL INTERCONNECTION SYSTEM; MATERIAL SYSTEM; SUBSTRATE METALLIZATION MATERIALS;

MICROSYSTEMS;

EID: 34249886024     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-682-n4.3     Document Type: Conference Paper

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