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Volumn , Issue , 2002, Pages 643-646

Power-constrained device and technology design for the end of scaling

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; LOGIC GATES; OPTIMIZATION; SILICON;

EID: 0036923408     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (12)

References (8)
  • 1
    • 0036508438 scopus 로고    scopus 로고
    • Interconnect opportunities for gigascale integration
    • J. D. Meindl, et al., "Interconnect opportunities for gigascale integration," IBM J. Res. Dev. 46, p.245 (2002).
    • (2002) IBM J. Res. Dev. , vol.46 , pp. 245
    • Meindl, J.D.1
  • 4
    • 0033722287 scopus 로고    scopus 로고
    • A minimum total power methodology...
    • A. J. Bhavnagarwala, et al., "A Minimum Total Power Methodology...," IEEE Trans VLSI Sys., 8, pp. 235-251 (2000).
    • (2000) IEEE Trans VLSI Sys. , vol.8 , pp. 235-251
    • Bhavnagarwala, A.J.1
  • 5
    • 33646900503 scopus 로고    scopus 로고
    • D. J. Frank, et al., Proc. IEEE 89, pp.259-288 (2001).
    • (2001) Proc. IEEE , vol.89 , pp. 259-288
    • Frank, D.J.1
  • 6
    • 0012257397 scopus 로고    scopus 로고
    • Ph.D. Thesis, Georgia Inst. Tech., Nov.
    • J. C. Eble, Ph.D. Thesis, Georgia Inst. Tech., Nov. 1998.
    • (1998)
    • Eble, J.C.1
  • 7
    • 0036508274 scopus 로고    scopus 로고
    • Power-constrained CMOS scaling limits
    • D. J. Frank, "Power-constrained CMOS scaling limits," IBM J. Res. Dev. 46, pp.235-244 (2002).
    • (2002) IBM J. Res. Dev. , vol.46 , pp. 235-244
    • Frank, D.J.1
  • 8
    • 0034431455 scopus 로고    scopus 로고
    • Fabrication and performance limits of sub 0.1 μm Cu interconnects
    • T. S. Kuan, et al., "Fabrication and performance limits of sub 0.1 μm Cu interconnects," Mat. Res. Soc. Symp. Proc. 612, pp.D7.1.1-8 (2000).
    • (2000) Mat. Res. Soc. Symp. Proc. , vol.612
    • Kuan, T.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.