Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 4, 2000, Pages 657-660

  Lin, Kwang Lung ^a,b   Hsu, Kun Tzu ^c  

^a IEEE   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS NICKEL; HIGH TEMPERATURE TREATMENT; HUMIDITY TESTING; SOLDER BUMP;

COPPER; ELECTROLESS PLATING; ELECTROPLATING; FRACTURE; HUMIDITY CONTROL; NICKEL; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERING; SPUTTER DEPOSITION; TITANIUM;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0034482865     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.888849     Document Type: Article

References (8)

1. G. M. Adema, C. J. Berry, N. G. Koopman, G. A. Rinne, E. K. Yung, and I. Turlike, "Flip chip technology: A method for providing known good die with high density interconnections," Int. J. Microcircuits Electron. Packag., vol. 17, no. 4, p. 352, 1994.
2. K. K. Yu and F. Tung, "Solder bump fabrication by electroplating for flip-chip applications," in Proc. 1993 IEEE/CHMT Int. Electron. Manufact. Technol. Symp., 1993, p. 277.
3. M. Warrior, "Reliability improvements in solder bump processing for flip chips," in Proceedings of the Electronic Components Conference. Piscataway, NJ: IEEE Press, 1990, p. 460.
4. M. Inaba, K. Yamakawa, and N. Iwase, "Solder bump formation using electroless plating and ultrasonic soldering," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 13, p. 119, Mar. 1990.
5. K. L. Lin and Y. C. Liu, "Soldering strength and materials interaction during reflow of Al/Cu/Electroless nickel/solder bumps," in Proc. 49th Electron. Comp. Technol. Conf., San Diego, CA, June 1-4, 1999.
6. K. L. Lin and C. J. Chen, "The interaction between In-Sn solders and on electroless Ni-P deposit upon heat treatment," J. Mater. Sci.: Mater. Electron., vol. 7, pp. 397-401, 1996.
7. K. L. Lin and J. T. Chang, U. S. Patent 5560813, Oct. 1, 1996.
8. K. L. Lin and Y. C. Liu, "The manufacturing of Cu/Electroless Nickel/Sn-Pb flip chip solder bumps," IEEE Trans. Adv. Packag., vol. 22, p. 568, Nov. 1999.