Bonding mechanism of electroless Ni-P film with AlN substrate and Cu foil

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 330-344

  Young, Chung Daw ^a   Duh, Jenq Gong ^b  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Bonding strength; Electroless Ni; Interfacial morphology; Mechanical interlocking

Indexed keywords

BOND STRENGTH (MATERIALS); COPPER; ELECTROLESS PLATING; INTERFACES (MATERIALS); METAL FOIL; METALLIC FILMS; MORPHOLOGY; SEMICONDUCTING ALUMINUM COMPOUNDS; THERMAL STRESS;

MECHANICAL INTERLOCKING;

ELECTRONICS PACKAGING;

EID: 0032090460     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705482     Document Type: Article

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