Technological breakthrough in pad life improvement and its impact on CMP CoC

10th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, ASMC 1999

Volumn , Issue , 1999, Pages 54-58

  Huey, Sidney ^a   Mear, Steven T ^a   Wang, Yuchun ^a   Jin, Raymond R ^a   Ceresi, John ^b   Freeman, Peter ^b   Johnson, Doug ^b   Vo, Tuyen ^b   Eppert, Stan ^b  

^a APPLIED MATERIALS INC   (United States)

^b Rodel   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MANUFACTURE; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS;

CONVENTIONAL PADS; COST OF CONSUMABLES; DESIGNED EXPERIMENTS; OPTIMIZED PROCESS; PAD CONDITIONING; POLISHING PROCESSS; PROCESS VARIABILITY; TECHNOLOGICAL BREAKTHROUGHS;

CHEMICAL MECHANICAL POLISHING;

EID: 84889802811     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.1999.798181     Document Type: Conference Paper

References (0)