Microwave frequency interconnection line model of a wafer level package

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 3, 2002, Pages 356-364

  Lee, Junwoo ^a   Ryu, Woonghwan ^b   Kim, Jingook ^a   Lee, Junho ^a   Kim, Namhoon ^a   Pak, Junso ^a   Kim, Jae Myun ^c   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b INTEL CORPORATION   (United States)

^c Hynix Semiconductor Inc   (South Korea)

Author keywords

Lumped circuit model; Rambus DRAM; S parameter measurement; Wafer level package

Indexed keywords

ATTENUATION; COMPUTER SIMULATION; DYNAMIC RANDOM ACCESS STORAGE; MICROWAVES; NATURAL FREQUENCIES; TIME DOMAIN ANALYSIS;

WAFER LEVEL PACKAGE (WLP);

WSI CIRCUITS;

EID: 0036706304     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.805317     Document Type: Conference Paper

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