Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 3, 1999, Pages 343-347

  Jeong, Jaeyong ^a  

^a Korea University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTRONICS PACKAGING; LUMPED PARAMETER NETWORKS;

BALL GRID ARRAY (BGA) PACKAGES;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033343787     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.784483     Document Type: Article

References (11)

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