NONLINEAR DEFORMATION OF MULTILAYER MEMS STRUCTURES

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1999-W, Issue , 1999, Pages 75-79

  Dunn, Martin L ^a   Zhang, Yanhang ^a   Roy, Jeffrey M ^a   Labossiere, Paul E W ^a   Bright, Victor M ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMECHANICAL DEVICES; MEMS; PLATES (STRUCTURAL COMPONENTS); POLYCRYSTALLINE MATERIALS; POLYSILICON;

DEFORMATION BEHAVIOR; DIFFERENT SIZES; GOLD FILM; GOLD PADS; INTEGRATED MICROSYSTEMS; LINEAR ANALYSIS; MICROELECTROMECHANICAL SYSTEM STRUCTURES; NONLINEAR DEFORMATIONS; PLATE STRUCTURE; TEST-STRUCTURE;

DEFORMATION;

EID: 0010049817     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1999-0248     Document Type: Conference Paper

References (8)

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2. Harsh, K. F., Zhang, W., Bright, V. M., and Lee,. Y. C., 1998, "Flip-Chip Assembly for Si-Based RF MEMS,” in Proc. 12th IEEE International Conference on Microelectromechanical Systems (MEMS '99), pp. 273-278.
3. Salamon, N. J. and Masters, C. B., 1995, “Bifurcation in Isotropic Thin Film/Substrate Plates,” Int. J. Solids Structures, Vol. 32, pp. 473-481.
4. Masters, C. B. and Salamon, N. J., 1993, “Geometrically Nonlinear Stress-Deflection Relations for Thin Film/Substrate Systems,” Int. J. Engng. Sci., Vol. 31, pp. 915-925.
5. Masters, C. B. and Salamon, N. J., 1994, “Geometrically Nonlinear Stress-Deflection Relations for Thin Film/Substrate Systems With a Finite Element Comparison,” J. Appl. Meeh., Vol. 61, pp. 872-878.
6. Fahnline, D. E., Masters, C. B., and Salamon, N. J., 1993, “Thin Film Stress From Nonspherical Substrate Bending Measurements,” J. Appl. Meeh., Vol. 61, pp. 872-878.
7. Miller, D., 1999, personal correspondence.
8. Wikstrom A., Gudmundson P., and Suresh S., 1999, “Thermoelastic Analysis of Periodic Thin Lines Deposited on a Substrate,” J. Meeh. Phys. Solids, Vol. 47, pp. 1113-1130.