High performance photo-sensitive insulating materials for high density multi-layer wiring boards

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 68-71

  Morishima, M ^a   Akahoshi, H ^a   Kawamoto, M ^a   Suwa, T ^a   Miyazaki, M ^a   Fukai, H ^b  

^a HITACHI LTD   (Japan)

^b High Performance Materials Department   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTER OPERATING PROCEDURES; MECHANICAL PROPERTIES; MICROELECTRONICS; MULTICHIP MODULES; PHOTOSENSITIVITY;

BUILD-UP SUBSTRATES; DIRECT CHIP ATTACHMENTS; ELECTRICAL AND MECHANICAL PROPERTIES; HIGH TEMPERATURE; HIGH-DENSITY PACKAGING; INSULATING PROPERTIES; INTERCONNECT RELIABILITY; PRESSURE COOKER TESTS;

CHIP SCALE PACKAGES;

EID: 0010007034     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704522     Document Type: Conference Paper

References (3)

1. K. Takagi, "Recent Technology Trends on MCM Organic Substrates. " The Joumal of Japan Institute for Interconnecting and Packaging Electronic Circuits, V01. 11, NO. 5, pp. 311-315, 1996
2. H. Holden "PPWB Build-up Technologies: Smaller, Thinner and Lighter" Circuit World, Vol. 23, No. 2, pp. 14-2 1, 1997.
3. Y. Tsukada, S. Tsuchida and Y. Mashimoto, "Surface Laminar Circuitry Packaging, " Proceedings of the 42nd Electronic Components and Technology Conference (ECTC), San Diego, California, May 18-20, pp. 22-27, 1992.