Cure kinetics modeling of ViaLuxTM 81: A novel epoxy photo-dielectric dry film (PDDF) for microvia applications

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 254-260

  Dunne, Rajiv C ^a   Sitaraman, Suresh K ^a   Luo, Shijian ^a   Wong, C P ^a   Estes, William E ^a   Periyasamy, Mookan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIELECTRIC FILMS; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; REACTION KINETICS; SEMICONDUCTOR DEVICE MODELS;

HIGH DENSITY-INTERCONNECT PRINTED WIRING BOARDS; PHOTODIELECTRIC DRY FILMS;

ELECTRONICS PACKAGING;

EID: 0033714953     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)