Comparison of various micro via technology

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 233-237

  Nishiwaki, Toshio ^a   Mikado, Yukinobu ^a   Kuroiwa, Nobuhiro ^a  

^a IBIDEN CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS;

ADDITIVE PATTERNING; SUBTRACTIVE PATTERNING;

ELECTRONICS PACKAGING;

EID: 0033683784     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)