Photovia technology: some important aspects for reliability

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 240-245

  Zhang, S ^a   De Baets, J ^a   Van Calster, A ^a   Corlatan, D ^a   De Langhe, P ^a   Allaert, K ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CRACK INITIATION; DESIGN FOR TESTABILITY; DIELECTRIC MATERIALS; ELASTIC MODULI; PHOTOLITHOGRAPHY; POLYMERS; PRINTED CIRCUIT BOARDS; RELIABILITY; THERMAL CYCLING; THERMAL EXPANSION; TOUGHNESS;

LOW ASPECT RATIOS; PHOTO IMAGABLE DIELECTRIC; PHOTO IMAGING; PHOTOVIA TECHNOLOGY; THERMAL SHOCK;

MICROELECTRONIC PROCESSING;

EID: 0033344348     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)