`Thick' plastic packages with `small' chips vs `thin' packages with `large' chips: How different is their propensity to moisture-induced failures?

American Society of Mechanical Engineers, EEP

Volumn 16, Issue , 1996, Pages 101-125

  Suhir, E ^a   Ilyas, Q S M ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); FAILURE ANALYSIS; GEOMETRY; INTEGRATED CIRCUITS; MOISTURE; SHEET MOLDING COMPOUNDS; STRESSES; THERMAL STRESS;

PLASTIC ELECTRONIC PACKAGES;

ELECTRONICS PACKAGING;

EID: 0030395399     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Review

References (12)