Thermal fatigue reliability assessment for solder joints of BGA assembly

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 239-243

  Yu, Qiang ^a   Shiratori, Masaki ^a  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346498264     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)

1. Chan, Y. W., Ju, T. H., Hereb, S.A., Lee, Y. C., Wu, J-S., and Lu, M-J, 1997, "Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints," ASME Advances in Electronic Packaging 1997, EEP-Vol. 19-2, pp.1507-1514.
2. Kitano, M. and Honda, M., "Shape Prediction of Solder Bump Joint by Surface Tension Analysis and Fatigue Strength Evaluation," ASME Advances in Electronic Packaging 1997, EEP-Vol. 19-2, 1407-1413.
3. Kuo, A-Y., Yin, W-L., Newport, D., and Chiang, M., "Generalized Stress Intensity Factor Concept for Fatigue and Fracture Evaluations of IC Package Solder Joints," ASME Advances in Electronic Packaging 1997, EEP-Vol. 19-2, 1451-1460.
4. Yu, Q. and Shiratori M., "Fatigue-Strength Prediction of Microelectronics Solder Joints Under Thermal Cyclic Loading," 1997, IEEE Trans. Comp., Hybrids, Manufact. Technol., vol.20, no. 2, pp. 266-273.
5. Yu, O., Kashiwamura, T., Shiratori, M., and Satoh, K., "Reliability and Structure Optimization of BGA Packages," ASME Advances in Electronic Packaging 1997, EEP-Vol. 19-2, 1761-1767.