Modelling complex via hole structures

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 149-152

  Laermans, Eric ^a   De Geest, Jan ^a   De Zutter, Daniël ^a   Olyslager, Frank ^a   Sercu, Stefaan ^a   Morlion, Danny ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CAPACITANCE; FINITE DIFFERENCE METHOD; INDUCTANCE; INTEGRAL EQUATIONS; MATRIX ALGEBRA; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; PROBLEM SOLVING; THREE DIMENSIONAL; TIME DOMAIN ANALYSIS;

HOLE STRUCTURES; MODELLING COMPLEX; SIGNAL INTEGRITY DESIGN TOOL;

SEMICONDUCTOR DEVICE MODELS;

EID: 0035703983     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

1. A signal integrity design tool for system interconnects
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3. Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines
4. Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function
5. Rigorous and simplified models for the capacitance of a circularly symmetric via
6. Scalar magnetostatic potential approach to the prediction of the excess inductance of grounded via's and via's through a hole in a ground plane
7. Coupled noise analysis for adjacent vias in multilayered digital circuits
8. Least-square estimation of the equivalent circuit parameters of a via-hole from a TDF reflectogram, including on-board rise time and delay estimation
9. A new approach for the experimental circuit modeling of coupled interconnection structures based on causality
10. Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method
11. Time-domain electromagnetic analysis of interconnects in a computer chip package
12. FDTD analysis of high frequency electronic interconnection effects
13. Characterization of high frequency interconnects using finite difference time domain and finite element methods
14. EM-ANN models for microstrip vias and interconnects in dataset circuits
15. Modelling differential via holes
16. Modelling differential via holes
17. Fast capacitance extraction of general three-dimensional structures
18. New fast and accurate line parameter calculation of multiconductor transmission lines in multilayered media