The effects of via transitions on differential signals

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 39-42

  Wang, Chen ^a   Fan, Jun ^a   Knighten, James L ^a   Smith, Norman W ^a   Alexander, Ray ^a   Drewniak, James L ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; ELECTRIC IMPEDANCE; ELECTROMAGNETIC WAVE PROPAGATION; ELECTROMAGNETIC WAVE REFLECTION; FINITE DIFFERENCE METHOD; FREQUENCIES; MICROSTRIP LINES; PERMITTIVITY; SCATTERING PARAMETERS; SUBSTRATES; TIME DOMAIN ANALYSIS; TRANSMISSION LINE THEORY;

DIFFERENTIAL SIGNAL; DIFFERENTIAL TRANSMISSION LINE; FINITE-DIFFERENCE TIME-DOMAIN METHOD;

ELECTROMAGNETIC FIELD EFFECTS;

EID: 0035703567     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Full wave analysis of propagation characteristics of a through-hole using the finite-difference time-domain method
2. Time-domain electromagnetic analysis of interconnects in a computer ship package
3. Derivation of equivalent circuits for multiplayer printed circuit board discontinuities using full wave models
4. FDTD analysis of high frequency electronic interconnection effects
5. Modeling differential via holes
6. Combined differential and common-mode scattering parameters: Theory and simulation