Microwave frequency crosstalk model of redistribution line patterns on wafer level package

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 2, 2002, Pages 265-271

  Sung, Myunghee ^a   Kim, Namhoon ^b   Lee, Junwoo ^a   Kim, Hyungsoo ^a   Choi, Baek Kyu ^c   Kim, Jae Myun ^d   Hong, Joon Ki ^d   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Silicon Image Inc   (United States)

^c Hyundai Autonet Co Ltd   (South Korea)

^d Hynix Semiconductor Inc   (South Korea)

Author keywords

CSP; Crosstalk; CSP; Model; Package; WLP

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; CROSSTALK; INDUCTANCE; MICROWAVE CIRCUITS; SPURIOUS SIGNAL NOISE; TIME DOMAIN ANALYSIS;

TIME DOMAIN TRANSMISSION (TDT) MEASUREMENTS;

WSI CIRCUITS;

EID: 0036589427     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.803306     Document Type: Conference Paper

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