Microwave frequency model of water level package and increased loading effect on rambus memory module

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 128-132

  Lee, J ^a   Choi, B ^a   Ahn, S ^a   Ryu, W ^a   Kim, J M ^a   Choi, K S ^a   Hong, J K ^a   Chun, H S ^a   Kim, J ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; COST EFFECTIVENESS; DATA STORAGE EQUIPMENT; DYNAMIC RANDOM ACCESS STORAGE; EQUIVALENT CIRCUITS; SPIN COATING;

CAPACITIVE LOADING; MICROWAVE FREQUENCY MODEL; RAMBUS IN LINE MEMORY MODULE; RAMBUS MEMORY MODULE; WAFER LEVEL PACKAGE;

ELECTRONICS PACKAGING;

EID: 0034822059     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. IC packaging update
2. Optimal structure of wafer level package for the electrical performance
3. Experimental analysis of transmission line parameters in high-speed GaAs digital circuit interconnects