High amplification compliant microtransmissions for rectilinear electrothermal actuators

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 776-783

  Chu, Larry L ^a   Hetrick, Joel A ^a   Gianchandani, Yogesh B ^a  

^a University of Wisconsin Madison   (United States)

Author keywords

Compliant mechanism; Displacement amplification; Microtransmission; Rectilinear bent beam electrothermal actuators

Indexed keywords

AMPLIFICATION; BORON; BUCKLING; DEFORMATION; ELASTICITY; MICROSTRUCTURE; NICKEL; PHOTOLITHOGRAPHY; SINGLE CRYSTALS; STRESSES;

COMPLIANT MECHANISM; DISPLACEMENT AMPLIFICATION; ELECTROTHERMAL ACTUATOR; MICROTRANSMISSION; RECTILINEAR ELECTROTHERMAL ACTUATOR;

ELECTROSTATIC ACTUATORS;

EID: 0036544397     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00020-1     Document Type: Conference Paper

References (16)

1. Bent-beam electrothermal actuators-Part I: Single beam and cascaded devices
2. Bent-beam electrothermal actuators-Part II: Linear and rotary microengines
3. Tailoring unconventional actuators using compliant transmissions: Design methods and applications
4. Tailoring materials with prescribed elastic properties
5. Strategies for systematic synthesis of compliant MEMS
6. Topology optimization of compliant mechanisms using the homogenization method
7. Micromechanical devices with embedded electro-thermal-compliant actuation
8. Compliant thermal microactuators
9. Thermo-magnetic metal flexure actuators
10. Synthesizing high-performance compliant stroke amplification systems for MEMS
11. Electro-thermal actuators using optimized compliant microtransmissions as rectilinear motion amplifiers
12. Compliant microtransmissions for rectilinear electrothermal actuators
13. A unified approach for topological and dimensional synthesis of compliant mechanisms
14. A bulk silicon dissolved wafer process for microelectromechanical systems
15. High-aspect-ratio micromachining via deep X-ray lithography
16. Temperature coefficients of material properties for electrodeposited MEMS