Impact of die attach material on Type II popcorn cracking

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 331-337

  Chan, K C ^a   Chai, T C ^a   Wong, E H ^a   Lim, T B ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTICS FORMING DIES; PLASTICS MOLDING; STRENGTH OF MATERIALS;

DIE ATTACH MATERIALS; POPCORN PERFORMANCE;

ELECTRONICS PACKAGING;

EID: 0032230633     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)