Warpage measurement comparison using shadow moiré and projection moiré methods

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 176-182

  Ding, Hai ^a   Powell, Reinhard E ^a   Hanna, Carl R ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ERROR ANALYSIS; INTEGRATED CIRCUITS; INTEGRATED OPTICS; MOIRE FRINGES; PROJECTION SYSTEMS; SURFACE TENSION; SYSTEMS ANALYSIS;

WARPAGE MEASUREMENTS;

ELECTRONICS PACKAGING;

EID: 0036297054     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Power to the package
2. Photonics challenge to electroic packaging
3. MCM packaging for present- and next-generation high clock-rate digital- and mixed-signal electronic systems: Areas for development
4. Theory for predicting composite laminate warpage resulting from fabrication
5. System for real-time measurements of thermally induced warpage in a simulated infrared soldering environment
6. A projection moiré system for measuring warpage with case studies
7. Warpage studies of HDI test vehicles during various thermal profiling