Design of encapsulating materials for advanced area bump packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 361-366

  Ito, S ^a   Kuroyanagi, A ^a   Mizutani, M ^a   Noro, H ^a  

^a NITTO DENKO CORPORATION   (Japan)

Author keywords

Costs; Electronic packaging thermal management; Electronics packaging; Flip chip; Frequency; Mass production; Plastics; Size control; Stress; Thermal pollution

Indexed keywords

COST REDUCTION; COSTS; DESIGN; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT DESIGN; PARTICLE SIZE; PLASTICS; POLLUTION; POLLUTION CONTROL; PROCESS CONTROL; STRESSES; SUBSTRATES; THERMAL EXPANSION; THERMAL POLLUTION; THERMAL SHOCK;

ELECTRONIC PACKAGING THERMAL MANAGEMENTS; FLIP CHIP; FREQUENCY; MASS PRODUCTION; SIZE CONTROL;

CHIP SCALE PACKAGES;

EID: 0009555828     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906401     Document Type: Conference Paper

References (3)

1. th Electronics Components Technology Conference." pp.1047-1051, 1998.
2. th Electronics Components Technology Conference." pp.319-329,2000.
3. rd quarter 2000,http://developer.intel.com/technology/itj/index.htm.