Some factors that affect performance of capillary flip chip underfills

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1998, Pages 21-28

  Edwards, Maury ^a  

^a Dexter Electronic Materials ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BENDING STRENGTH; CAPILLARY FLOW; DIFFERENTIAL SCANNING CALORIMETRY; ELASTIC MODULI; FLIP CHIP DEVICES; FLOW MEASUREMENT; GLASS TRANSITION; PLASTICS FILLERS; TEMPERATURE; THERMAL EXPANSION; VISCOSITY; CHIP SCALE PACKAGES; INTERFACES (MATERIALS);

CAPILLARY FLIP CHIP UNDERFILLS; COEFFICIENT OF THERMAL EXPANSION; FLOW RATE; THERMOMECHANICAL ANALYZER;

ELECTRONICS PACKAGING; PACKAGING MATERIALS;

FLIP CHIP; PROCESS VARIABLES; PRODUCT INFORMATION; UNDERFILL MATERIALS; UNDERFILLS;

EID: 0032230988     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (0)