High-frequency wirebonding: Process and reliability implications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 881-890

  Charles Jr , Harry K ^a   Mach, K J ^a   Lehtonen, S J ^a   Francomacaro, A S ^a   DeBoy, J S ^a   Edwards, R L ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BONDING; FREQUENCIES; METALLIZING; SHEAR STRENGTH; STATISTICAL METHODS; SUBSTRATES; TRANSDUCERS;

WIREBONDING;

MICROELECTRONIC PROCESSING;

EID: 0036292711     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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