Wirebonding on various multichip module substrates and metallurgies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 670-675

  Charles Jr , Harry K ^a   Mach, Katherine J ^a   Edwards, Richard L ^a   Lehtonen, S John ^a   Lee, David M ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CERAMIC MATERIALS; COMPOSITE MATERIALS; ELECTRONICS PACKAGING; GOLD; OXIDES; SEMICONDUCTOR MATERIALS; SOLDERING; SUBSTRATES;

SOFT SUBSTRATE SYSTEMS; THERMOSONIC GOLD BALL BONDING; WIREBONDING;

MULTICHIP MODULES;

EID: 0030704198     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)