Wirebonding: Re-inventing the process for MCMs

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 645-655

  Charles Jr , H K ^a   Mach, K J ^a   Edwards, R L ^a   Francomacaro, A S ^a   Lehtonen, S J ^a   DeBoy, J S ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC WIRE; LAMINATES; MATERIALS TESTING; MULTICHIP MODULES; RELIABILITY; SUBSTRATES;

CHIP-ON-BOARD; WIREBONDING;

ELECTRONICS PACKAGING;

EID: 0032307343     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)