High-frequency wirebonding: Its impact on bonding machine parameters and MCM substrate bondability

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 350-360

  Charles Jr , Harry K ^a   Lehtonen, S J ^a   Mach, K J ^a   Edwards, R L ^a   Francomacaro, A S ^a   DeBoy, J S ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

Bonding machine setup; High frequency wirebonding; MCM wirebonds; Statistical analysis of wirebonding results; Wirebond reliability; Wirebond testing

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; METALLIZING; NATURAL FREQUENCIES; SUBSTRATES; TRANSDUCERS; ULTRASONIC EFFECTS; WAVEFORM ANALYSIS;

BONDING MACHINE SETUP; HIGH-FREQUENCY WIREBONDING; MULTI CHIP MODULES (MCM);

ELECTRIC WIRE;

EID: 0035772474     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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