Wirebonds for munitions applications: Effects of dynamic shock, vibration, and spin

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 503-510

  Lehtonen, S J ^a   Charles Jr , H K ^a   Katulka, G ^a   Burke, L ^a   Muller, Peter ^a   Hundley, N ^a   Ridgley, M ^a  

^a JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

Electrical interconnect; High G force; Shock pulse response; Wirebonds

Indexed keywords

AMMUNITION; DEFORMATION; FINITE ELEMENT METHOD; IMAGING TECHNIQUES; INTERCONNECTION NETWORKS; PROJECTILES; VIBRATIONS (MECHANICAL); WIRE; X RAYS;

ELECTRICAL INTERCONNECTS; VIBRATION FORCES; WIREBONDS;

MICROELECTRONICS;

EID: 0035768540     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. "Telemetry Systems and Electric Gun Projectiles," W. D'Amico, IEEE Transactions on Magnetics, Vol 37, No. 1, January 2001.
2. "Telemetered High-G Flight Test of an FPGA/PCM Encoder," D. Hepner, and G. Borgen, 46th International Instrumentation Symposium, Bellevue, WA, May 07, 2000.
3. "Characterization of Silicon Carbide and Commercial Off The Shelf Components for High-G Launch and EM Applications," G. Katulka, D. Hepner, B. Davis, E. Irwin, M. Ridgley, and K. Kornegay, IEEE Transactions on Magnetics, Vol 37, No. 1, January 2001.