Interfacial adhesion and microstructure of thick film metallized aluminum nitride substrates

Ceramics International

Volumn 28, Issue 1, 2002, Pages 23-28

  Tsai, Chir Jang ^a   Tseng, Wenjea J ^b   Hsi, Chi Shiung ^a  

^a I SHOU UNIVERSITY   (Taiwan)

^b CHINESE CULTURE UNIVERSITY   (Taiwan)

Author keywords

B. Interfaces; C. Fracture; D. AlN; Thick film metallization

Indexed keywords

ADHESION; ALUMINA; CRYSTAL MICROSTRUCTURE; FRACTURE; HEAT TREATMENT; METALLIZING; POLYCRYSTALLINE MATERIALS; RESISTORS; SUBSTRATES; SURFACE CHEMISTRY; THICK FILMS;

INTERFACIAL ADHESION;

ALUMINUM NITRIDE;

EID: 0036134082     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0272-8842(01)00053-0     Document Type: Article

References (18)

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