Bonding mechanism and stress distribution of a glass frit free thick film metallization for AlN-ceramic

Journal of Materials Science: Materials in Electronics

Volumn 9, Issue 6, 1998, Pages 429-434

  Reicher, R ^a   Smetana, W ^a   Gruber, E U ^b   Schuster, J C ^b  

^a VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^b UNIVERSITY OF VIENNA   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVE PASTES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GLASS BONDING; INTERMETALLICS; METALLIZING; STRESS CONCENTRATION; SUBSTRATES; SYNTHESIS (CHEMICAL); THERMAL CONDUCTIVITY; THICK FILMS; ALUMINUM COMPOUNDS; NUMERICAL ANALYSIS; STRESS ANALYSIS; THERMAL CONDUCTIVITY OF SOLIDS;

BONDING MECHANISM; GLASS PHASE; THICK FILM PASTES; ALUMINUM NITRIDE;

ALUMINUM NITRIDE; CERAMIC MATERIALS;

EID: 0032281518     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008985505140     Document Type: Article

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