Influence of particulate Al2O3 addition on interfacial microstructure and electrical sheet resistance of thick film metallized aluminum nitride substrates

Materials Letters

Volumn 47, Issue 3, 2001, Pages 128-132

  Tseng, Wenjea J ^a   Tsai, Chir Jang ^b   Hsi, Chi Shiung ^b  

^a CHINESE CULTURE UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ALUMINA; ALUMINUM NITRIDE; INTERFACES (MATERIALS); METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; POWDERS; SUBSTRATES; THICK FILMS;

SHEET RESISTANCE;

METALLIC FILMS;

EID: 0035131238     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(00)00223-8     Document Type: Article

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