Copper thick film conductor for aluminum nitride substrates

IEICE Transactions on Electronics

Volumn E79-C, Issue 6, 1996, Pages 845-852

  Endoh, Tsuneo ^a   Kurihara, Yasutoshi ^a  

^a HITACHI LTD   (Japan)

Author keywords

Aluminum nitride; Ceramics; Copper conductor; Hybrid 1c; Thick flm

Indexed keywords

ADHESION; ALUMINUM COMPOUNDS; CERAMIC MATERIALS; CONDUCTIVE FILMS; COPPER; OXIDATION; OXIDES; PHYSICAL PROPERTIES; PYROLYSIS; SOLDERING ALLOYS; SUBSTRATES; THICK FILM CIRCUITS;

ADHESION STRENGTH; ALUMINUM NITRIDE; SOLDER WETTABILITY;

HYBRID INTEGRATED CIRCUITS;

EID: 0030171630     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

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