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Volumn 20, Issue 1, 2002, Pages 431-435

Nondestructive analysis of ultrashallow junction implant damage by combined technology of thermal wave and spectroscopic methods

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC; BORON; CRYSTAL DEFECTS; ELLIPSOMETRY; ION IMPLANTATION; NONDESTRUCTIVE EXAMINATION; OPTICAL DEVICES; PUMPING (LASER); REFLECTOMETERS; SILICON WAFERS; SPECTROSCOPIC ANALYSIS; THERMAL EFFECTS;

EID: 0036124842     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1446453     Document Type: Conference Paper
Times cited : (2)

References (12)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.