Leadless sensor packaging for high temperature applications

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2002, Pages 392-395

  Masheeb, Fawzia ^a   Stefanescu, Sorin ^a   Ned, Alexander A ^a   Kurtz, Anthony D ^a   Beheim, Glenn ^b  

^a Kulite Semiconductor Products Inc   (United States)

^b NASA GLENN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS FIBERS; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE TESTING; METALS; MICROMACHINING; PARTIAL PRESSURE; PARTIAL PRESSURE SENSORS; SEMICONDUCTING SILICON COMPOUNDS;

ELECTRICAL INTERCONNECTS; LEADLESS SENSOR PACKAGING; METAL GLASS FRITS MIXTURE; WIREBONDING;

ELECTRONICS PACKAGING;

EID: 0036120547     PISSN: 10846999     EISSN: None     Source Type: Journal    
DOI: 10.1109/MEMSYS.2002.984285     Document Type: Article

References (11)

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