High temperature testing of nickel wire bonds for SiC devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3893, Issue , 1999, Pages 324-333

  Burla, Ravi K ^a   Roy, Shuvo ^a   Haria, Vishal M ^a   Zorman, Christian A ^a   Mehregany, Mehran ^a  

^a CASE WESTERN RESERVE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BONDING; BRITTLENESS; CRACK PROPAGATION; FAILURE ANALYSIS; HIGH TEMPERATURE EFFECTS; NICKEL; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; SUBSTRATES;

BRITTLE CRACKS; THERMOSONIC WIRE BONDING; ULTRASONIC WIRE BONDING; WEDGE FORMATION;

MICROELECTRONICS;

EID: 0033345763     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)