Micro & nanoDAC - A powerful technique for nondestructive microcrack evaluation

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4703, Issue , 2002, Pages 194-198

  Michel, Bernd ^a   Vogel, Dietmar ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Electronic packaging; Fracture electronics; Fracture mechanics; Micro materials; MicroDAC; NanoDAC; Nanomechanics; Parametrized finite elements

Indexed keywords

ALGORITHMS; ATOMIC FORCE MICROSCOPY; COMPUTER SIMULATION; CORRELATION METHODS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FRACTURE MECHANICS; MICROCRACKS; NONDESTRUCTIVE EXAMINATION; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT; STRESS ANALYSIS;

NANOMECHANICS;

MICROELECTRONIC PROCESSING;

EID: 0036030118     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.469623     Document Type: Conference Paper

References (9)

1. B. Michel, "Fracture Electronics - Concepts of Fracture Mechanics for Reliability Estimation in Microelectronics and Microsystem Technology". Proc. MicroMat Conference, Berlin 1997, p. 382.
2. D. Vogel, F. Luczak, A. Schubert, and B. Michel, "microDAC Deformation Analysis on Solder Interconnects for Flip Chip", InterPack '99, Lahaina, Hawaii, USA, 1999.
3. B. Michel, D. Vogel, and V. Grosser, "Mechanical Properties of Microsystem Components", Laser Interferometry IX, Applications, San Diego, 1998, Proc. of SPIE, Vol. 3479, pp. 140-151.
4. J. Auersperg, D. Vogel, J. Simon, A. Schubert, and B. Michel, "Reliability Evaluation of Chip Scale Packages and microDAC", Proc. Symp. on Design and Reliability of Solders and Solder Interconnects, held during the TMS Annual Meeting, Orlando, USA, Febr. 9-13, 1997, pp. 439-449.
5. D. Vogel, A. Gollhardt, and B. Michel, "Ongoing Research in the Nanomechanics Lab Berlin-Adlershof", Micromaterials and Nanomaterials No. 1, Berlin 2002, pp. 3-7.
6. D. Vogel, E. Kaulfersch, J. Simon, R. Kuehnert, A. Schubert, and B. Michel, "Measurement of Thermally Induced Strains on Flip Chip and Chip Scale Packages", Proc. of ITherm 2000, Las Vegas, USA, May 2000, pp. 232-239.
7. D. Vogel, J. Auersperg, A. Schubert, B. Michel, and H. Reichl, "Deformation Analysis on Flip Chip Solder Interconnect by microDAC", Proc. of the Reliability of Solders and Solder Joints Symposium at 126 TMS Annual Meeting and Exhibition, TMS Publication Cat. No. 96-80433, Orlando, USA, 1997, pp. 429-438.
8. D. Vogel, R. Kuehnert, and B. Michel, "Strain Measurement in Micrometrology", Int. Symp. on Photordcs and Applications ISPA '99, Singapore, Proc. of SPIE, Vol. 3897, pp. 224-238.
9. R. Dudek, M. Nylén, A. Schubert, B. Michel, H. Reichl, "An Efficient Aprroach to Predict Solder Fatigue Life and its Application to SM-and Area Array Components", ECTC 47, San Jose, May 1997, Proc. pp. 462-471.