Mechanical properties of microsystem components

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3479, Issue , 1998, Pages 140-151

  Michel, Bernd ^a   Vogel, Dietmar ^a   Grosser, Volker ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; DEFORMATION; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HOLOGRAPHIC INTERFEROMETRY; HOLOGRAPHY; INTERFEROMETERS; INTERFEROMETRY; LASERS; MATERIALS PROPERTIES; MECHANICAL ENGINEERING; MECHANICAL PROPERTIES; MICROELECTRONICS; MICROSYSTEMS; OPTICAL DATA PROCESSING; PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SPECKLE; SURFACE ANALYSIS; THERMOMECHANICAL TREATMENT;

ACTUATOR ARRAYS; ADVANCED PACKAGING; AUTO FOCUSES; BALL GRIDS; CHIP SCALES; COMPLEX SYSTEMS; DEFORMATION BEHAVIORS; DEFORMATION MEASUREMENTS; DEVICES AND COMPONENTS; EXPERIMENTAL DEFORMATIONS; FINITE ELEMENTS; FLIP CHIP TECHNOLOGIES; FUNCTIONAL PERFORMANCES; GLOB TOPS; INTERFERENCE MICROSCOPIES; LASER INTERFEROMETRIC; LASER METHODS; MATERIAL PROPERTIES; MEASUREMENT TECHNIQUES; MECHANICAL BEHAVIORS; MECHANICAL RELIABILITIES; MICRO TECHNOLOGIES; MICROELECTRONICS AND MICROSYSTEMS; NEW GENERATIONS; NEW MATERIALS; OPTICAL MEASUREMENTS; OPTICAL METHODS; PRODUCTION LINES; RESEARCH AND DEVELOPMENTS; SPECKLE PHOTOGRAPHIES; SPECULAR SURFACES; SURFACE CHARACTERISTICS; SURFACE PROFILES; THERMO MECHANICALS;

SURFACES;

EID: 0000379971     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.316443     Document Type: Conference Paper

References (7)

1. B. Michel, "Fracture electronics - concepts of fracture mechanics for reliability estimation in microelectronics and microsystem technology", Proc. Micro Materials '97 Conference, Berlin, Apr. 16-18, 1997, Berlin, ddp Goldenbogen 1997, pp. 382-389.
2. B. Michel, A. Schubert, R. Dudek, V. Grosser, "Experimental and numerical investigations of thermo-mechanically stressed micro components", Microsystem Technologies 1 (1994) 1, pp. 14-22.
3. D. Vogel, A. Schubert, W. Faust, R. Dudek, B. Michel, "MicroDAC - A novel approach to measure in situ deformation fields of microscopic scale", Microelectronics Reliability 36 (1996) 11/12, pp. 1339-1342.
4. J. Auersperg, D. Vogel, J. Simon, A. Schubert, B. Michel, "Reliability evaluation of chip scale packages by FEA and microDAC", Proc. on Design and Reliability of Solders and Solder Interconnects, TMS Annual Meeting, Orlando, Febr. 9-13, 1997, pp. 439-445.
5. B. Michel, T. Winkler, H. Reichi, "Fracture electronics - application of fracture mechanics to microelectronic systems and chip packages", Proc. 9th mt. Conf. on Fracture (ICF 9), Sydney, Apr. 1-5, 1997, in: Advances in Fracture Research (ed. B. Karihalo), vol. 6, pp. 3107-3112, Pergamon Press 1997.
6. Michel, B.; Kuhnert, R.: Mikro-Moire-Methode und MikroDAC-Verfahren anwenden, Zeitschrift Materialprüfung 38 (1996), No. 6.
7. th European Solid-State Device Research Conf., 1998 ,Sept. 8 - 10, Bordeaux, France