In-situ TEM investigation during thermal cycling of thin copper films

Materials Research Society Symposium - Proceedings

Volumn 436, Issue , 1996, Pages

  Keller, R M ^a   Sigle, W ^a   Baker, S P ^a   Kraft, O ^a   Arzt, E ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; DISLOCATIONS (CRYSTALS); GRAIN GROWTH; PLASTIC DEFORMATION; STRAIN MEASUREMENT; TEMPERATURE; THERMAL CYCLING; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

DISLOCATION MOTION; STRESS TEMPERATURE CURVES; SUBSTRATE CURVATURE METHOD;

METALLIC FILMS;

EID: 0030399306     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-436-221     Document Type: Conference Review

References (8)